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Amkor Technology, Inc. is a leading provider of outsourced semiconductor assembly and test (OSAT) services founded in 1968 and headquartered at 2045 E. Innovation Circle, Tempe, Arizona 85284, United States.
Amkor specializes in IC packaging formats such as flip-chip, wafer‐level packaging (WLP), ball grid array (BGA), chip scale packaging, and advanced technologies including Through-Silicon Via (TSV), Through-Mold Via (TMV®), and System-in-Package (SiP). The company supports global OEMs and semiconductor firms with high volume manufacturing, test, wafer bumping, reliability services, and package design. Amkor has over 28,000 employees in ~20 manufacturing / assembly and test sites across Asia, EMEA, and the U.S.
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